Download Design Guidelines for Surface Mount Technology by John E. Traister PDF

By John E. Traister

Contents: part choice; area making plans and Interface; Specifying fabric for Substrates; The SMT meeting procedure; touch Geometry for SMT parts; layout instructions; paintings iteration. Appendixes. This ebook is a pragmatic, engineering-level consultant to designing with floor mounting expertise and the producing strategies concerned.

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SOT, diode and transistor packages can also be furnished in tape and reel, as shown in Fig. 2-3. Because these are polarized components, the direction of the feed must be specified. Close communication between the design engineer­ ing department and the manufacturing operation is essential to insure planning early in the development of SMT products. Fig, 2-3: SOT-23 Diodes and transistors are available from several manufacturers in tapeand-reel form; two options are shown here. Component Selection Guidelines Surface mounted technology will offer more assembly options than through-hole.

Some touch-up will be required even with advanced wave solder techniques and secondary hot air processes. • I I • I • r oo I. - o-o o o o o o o o o ι Η ΜΜ Μ L Utilize one J OOOOOOOOOOOD • ι • r I I side for s u r f a c e m o u n t e d devices - the opposite for l e a d e d devices. Fig. 2-30: Locating SMDs under leaded devices will maximize the work area. When it becomes necessary to mix SMDs with leaded devices, one option is the two-sided assembly. The majority of the active components will be mounted on side one of the module, while chip components will be mounted on the opposite side—the solder side of the assembly.

You will also have a choice in packaging. Tape and reel may be preferred by many companies with medium to high volume production, while tube maga­ zine is recommended for lower volume production, or when inhouse testing of each IC is necessary. Plastic Chip Carriers and Quad Packages The most successful area of standardization has been in the plastic molded commercial grade devices. Several package styles registered with JEDEC comply to size and lead design that is common to many domestic, European and Japanese component manufacturers.

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